In the context of digitization and Industry 4.0, approaches based on AI methods are increasingly moving into the focus of product developers. A major focus is on approaches that are used wherever it is impossible for developers to describe explicit solution procedures or data is available in noisy form. The basis for all learning methods is data acquisition with sensors. The trend towards networking any systems in the Internet of Things places high demands on product development. The multitude of individual machines, products and systems on the one hand is contrasted by classic silicon-based, two-dimensional AVT from mass electronics. There is a discrepancy between the need for individual sensor technology and the electronics technologies available on the market. The merging of the technology fields of Additive Manufacturing (AM) and Mechatronic Integrated Devices has the potential to address these challenges. AM enables new component structures and low-cost manufacturing. MIDs are 3D circuit carriers that combine electrical and mechanical functions in one component. Thus, packages with high functional safety and density as well as a high degree of miniaturization can be realized. MID technology provides a wide range of processes for implementation. The established manufacturing process for larger quantities is laser direct structuring, in which an activatable thermoplastic is structured by means of a laser and then partially metallized. The project will analyze and characterize possible applications of AM-MID in mechanical and plant engineering. The focus is on the CMID process, which allows any metallic base bodies, and the stereolithography process, which allows additively produced base bodies and for which a special MID photopolymer has been developed.

Tomorrow's technical systems are based more than ever on the synergetic interaction of a wide range of disciplines. These intelligent technical systems (or cyber-physical systems) expand formerly singular mechatronic systems to include communication and cooperation capabilities and become networked systems. However, the structure of the subsystems still consists of the four units basic system, sensors, actuators and information processing. The sensors provide the necessary input variables for information processing and thus form the essential key component for sensing the basic system itself and the environment. New design and material properties, as well as increasing miniaturization and simultaneous cost reduction, are enabling new types of intelligent sensors that already have integrated information processing. In the context of digitalization and Industry 4.0, approaches based on artificial intelligence processes are increasingly moving into the focus of product developers. Machine learning approaches, which are used wherever developers are unable to describe explicit solution procedures or where data is noisy or incomplete, are a key focus. The basis for all learning methods is data acquisition with (intelligent) sensors. The trend towards networking any systems in the Internet of Things (IoT) places high demands on product development. The multitude of different, individual machines, products and systems on the one hand is contrasted by classic silicon-based, two-dimensional assembly and connection technologies from mass electronics. There is a discrepancy between the need for individual intelligent sensor technology and the electronics technologies available on the market.

The merging of the two technology fields of additive manufacturing (AM) and mechatronic integrated devices (MID) has the potential to meet these challenges. AM enables new component structures with expanded geometric freedom that cannot be implemented with established manufacturing processes, or only at disproportionately high expense. Cost-effective manufacturing, by eliminating the need for molding tools, also speaks in favor of additive manufacturing. MIDs are three-dimensional, usually injection-molded circuit carriers. By integrating mechanical and electronic functions on a spatial circuit carrier, packages with high functional reliability and density as well as a considerable degree of miniaturization can be realized. MID technology provides a wide range of processes for implementation. The established manufacturing process for larger quantities is laser direct structuring (LDS), in which an activatable thermoplastic is structured by means of a laser and then partially metallized. The project will analyze and characterize possible applications of AM-MID in mechanical and plant engineering. The focus is on the CMID process (powder coating-based), which allows any metallic base bodies, and the stereolithography process, which allows additively produced base bodies and for which a special MID photopolymer has been developed. The overall objective is divided into two strands. On the one hand, an extended system is being developed that integrates design information, manufacturing-specific restrictions and functional solution aspects. Secondly, the contents of the system are to be validated on the basis of the design and implementation of demonstrators. Suitable assemblies from the partner companies will be selected for this purpose. Subsequently, the implementation will be carried out within the framework of demonstrators.

 As already stated, there is a lack of suitable methods and tools that simplify the development of individual MID-based IoT sensor systems and reduce the effort. In order to enable even inexperienced users to develop individual MID sensor systems, a systematic is developed, which consists of three essential components: 

1. Procedural model: The elaborated procedural model divides the development process into clearly defined steps, summarizes the associated tasks and shows the expected results. The development process is thus comprehensible and transparent for those involved.  



2. Sensor construction kit: The core of the system is a sensor construction kit. For this, a reference architecture of wireless sensor systems is developed. This architecture is divided into different function blocks, taking into account various boundary conditions. Among other things, each function block has a fixed size, arrangement of interfaces and a layout suitable for production. The user is thus able to select suitable components according to his application and to interconnect them to form a complete system. In order to reduce the development expenditure further, a partially automated modular software production realisert. With select the components, an executable code is generated, which realizes the basic functionalities of the sensor system, such as data acquisition and data transmission. 



3. Fault catalog: A key feature of MIDs is the strong dependence between product and production system. The design of the MID component is already influenced by manufacturing restrictions during development. It is important during development to consider specific design guidelines. Nevertheless, unforeseen errors or problems occur during practical production. The technology-specific error catalog enables the identification of typical error patterns, their causes and suitable countermeasures. Overall, the manufacture of MIDs is an extremely complex process characterized by a large number of interactions. With the error catalog, it is possible, especially for inexperienced users, to identify specific errors and initiate suitable countermeasures.